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FAQ

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  • Frequently asked questions for Placement Machine

    We've been using contractors for circuit board prototyping and assembly. What makes you so sure we can do these tasks in-house with no previous experience?

    Many companies have seen a major decrease in PCB production expenses by bringing their circuit board prototyping and assembly in-house. Quicker turn-around, better quality control and faster test and implementation of engineering changes are added advantages.

  • SMT nozzle selection should follow what kind of principle?

    SMT nozzle selection should follow what kind of principle?
    When the installation smt nozzle should follow some principle, for the universal SMT nozzle how to choose.
  • How to improve SMT nozzles useful life?

    How to  improve SMT nozzles  useful life? First of all can be sure that the quality of the nozzle is very important,In addition to the daily maintenance and maintenance is also very important, 
  • SMT placement machine odd Nozzle

    What is SMT odd nozzle? In the daily SMT machining operation, the vast majority of materials can be used to absorb the conventional smt nozzle, but sometimes encountered some unconventional materials, the conventional nozzle is not suck up, or the throwing rate is very high, in this case need to be based on the size and shape of materials to customize the odd nozzle.



  • How to quickly remove plastic ball grid array package (PBGA) from pcb board

    How to remove the plastic ball grid array package (PBGA) from the printed circuit board (PCB), which is the necessary skills for every hardware division. ADI gives a set of recommended rework procedures for removing the PBGA package from the PCB.
  • How to select Samsung SMT nozzle model and precautions!

    From the Samsung Mounter nozzle type can be seen on the nozzle of the corresponding size of the model,

     so it is not difficult to choose the corresponding components.CN020, CN030 is mainly used to play
     0201,0402 components, CN040: 0402,0603, CN065 with the mostextensive,

  • How to choose SMT consumable material ?

    1) Dissolving the oxide film on the surface of the substrate to be welded In the atmosphere, the surface of the substrate to be bonded is always covered with an oxide film having a thickness of about 2 × 10-9 to 2 × 10-8 m. In the welding, the oxide film will inevitably prevent the solder on the base metal wetting,
  • What is the reason for the unqualified of SMT chip processing?

    What is the reason for the quality of SMT chip processing?SMT process frequently quality problems are missing pieces, side pieces, flip pieces, offset, loss pieces, etc., Now learn much more about the quality of SMT chip process problems as follows.

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