1:Varies depending on selectable Specifications.
2:It varies depending on the specification of PCBs.
3:Excluding batch exchange cart and tape feeder.
4:Excluding recognition monitor and signal tower.
5:Fixed component supply unit specification
including a feeder cart : BM123 : 2 100 kg, BM133 : 2 200 kg, BM221 : 2 200 kg, BM231 : 2 300 kg
A wide range of component, quick changeover capabilities
Panasonic BM Series PCB Placement Equipment
Ensures continuous productivity by placing components from (01005”) 0402* to L 55 mm × W 55 mm or L 150 mm × W 25 mm components on tape, reel and tray.
The BM221 & 231 offer productivity with up to 120 tape and 80 tray (JEDEC standard) inputs.
Fast, accurate placement
The 8-nozzle vertical drive provides batch recognition and batch pick-up for components in variable heights (It differs depending on the condition).
A variation of available options for the supply unit [BM221]
2D and 3D sensors are used to accurately place components ranging from microchips to L 55 mm x W 55 mm x T 25 mm, QFPs, BGAs and CSPs.
Chip thickness measuring sensor (optional)
The chip thickness senser measures the thickness of components to improve placement quality.
Direct tray support function