Joy Technology Co.,Limited

welding Technology ?
Welding is a relatively complicated physical and chemical process. When soldering metal with solder,
with the help of the heating of the soldering iron and the help of the flux, the solder first wets the soldering surface
and gradually diffuses into the metal, in contact with the metal. The surface forms an adhesion layer, which forms a reliable metal alloy after cooling.



1. Applying a solder paste process
Applying solder paste is a key process to ensure SMT quality. Currently, stencil printing is generally used.

According to big data analysis and statistics, under the premise of correct PCB design, quality of components and printed boards,
 60%-80% of the quality problems in surface assembly quality are in the printing process.


1. Solder paste is a paste made by alloy solder powder and paste flux.
1) Solder paste: The molten solder is atomized into a fine granular metal in an inert gas. There are two kinds of particle shapes of
the metal powder in the solder paste: spherical shape and amorphous shape.

The fineness of the metal powder in the solder paste is 20 to 75 μm. In general, the choice of fineness of solder paste particles is based
on the fact that the minimum size of the metal stencil opening should allow 3 to 4 particles to pass at the same time. For fine pitch components,
 the fineness of the particles should be 20 to 40 microns. Ball solder paste between.

The smaller the particle size, the greater the viscosity; if the particle size is too large, the solder paste bonding performance will be deteriorated. If the particle size is too fine, the surface area will increase due to an increase in surface area, so that it cannot be used.
Flux ?

2) The traditional flux is usually based on rosin. The rosin has weak acidity and hot melt fluidity, and has good insulation,
moisture resistance, non-corrosiveness, non-toxicity and long-term stability, and is a rare flux. Material.
Through the action of the active agent in the flux, the surface of the material to be soldered and the oxide of the tin powder
itself can be removed, so that the solder rapidly diffuses and adheres to the surface of the metal to be soldered.
 The composition of the flux enhances the solder paste. Wetting property. Collapse, viscosity change, cleanability, and shelf life play a decisive role.
What is the chemical composition of the flux?

Flux should have the following effects:
(1). Remove the oxide on the solder surface to prevent re-oxidation of the solder and solder surface during soldering to reduce the surface tension of the solder.
(2). The melting point is lower than the solder. Before the solder melts, the flux should be melted first to fully exert the fluxing effect.
(3). The diffusion rate of infiltration is faster than that of molten solder, and it is usually required to expand by about 90% or more.
(4). Viscosity and specific gravity are smaller than solder, the viscosity of the assembly makes the wetting diffusion difficult, and the specific surface can not cover the solder surface.
(5). No welding bead splashing during welding, no toxic gas and strong irritating odor.
(6). The residue after welding is easy to remove, and has characteristics of no corrosion, no moisture absorption and no electricity.
(7). Non-sticking, no sticking after welding, the solder joint is not easy to sharpen.
(8). Stable storage at room temperature



At present, most of the active fluxes used in SMT are rosin-based active fluxes. Because rosin differs greatly in chemical composition and performance depending on the variety, origin and production process, it is preferable to ensure the quality of flux for rosin. key. 
Usually flux also includes the following components: active agent, film-forming material, additives (matting agent, brightener, corrosion inhibitor, flame retardant) and solvent.



In the welding industry, it is customary to refer to a solder having a soldering temperature of less than 450 ° C as a soft solder. The soldering temperature of the electronic circuit is usually between 180 ° C and 300 ° C. The solder used is tin and lead, so it is also called tin lead solder.

?The tin-lead alloy is mainly used, and some tin solders also contain a small amount of antimony. A tin alloy containing 37% lead and 63% tin is commonly known as solder and has a melting point of about 183 °C. This is the most common tin lead solder.
Reflow soldering temperature of different melting point solder pastes:
Alloy type melting    temperature    reflow temperature
Sn63/Pb37             183                           208-223
Sn60/Pb40             183-190                     210-220
Sn50/Pb50             183-216                     236-246
Sn45/Pb55             183-227                     247-257
Sn40/Pb60             183-238                     258-268
Sn30/Pb70             183-255                     275-285
Sn25/Pb75             183-266                     286-296
Sn15/Pb85             227-288                     308-318



JOY TECHNOLOGY Can also supply other DEK Parts:
DEK Belt Drive Rear Rail Motor Maxon 157729
107686 SCB9 OPTO ISOLATOR I/P PCB 
107689 40 CHANNEL DIGITAL I/O PCB 
145014 EUROSYSTEM CONTROLLER RS485 16MHZ 
117933 117933 I.C. , STEPPER DRIVE CARD
114025 EUROAMP 10 CARD UL 
107758 TOOLING 
145520 dek camera y motor 
160706 dek camera y motor 
160708 RISING TABLE SERVO MOTOR
185003 MOTOR^CAMERA Y^(BG65X50-CI)^WITH 7.66:1 GEARBOX 
185002 MOTOR^CAMERA X^(BG65X50-CI)^WITH 7.66:1 GEARBOX 
145817 CAMERA 'X' MOTOR AT/20' 
160704 CAMERA X SERVO MOTOR
191492 BOM^ASSY.^MOTOR^RISING TABLE 
188962 BOM^MOTOR^DRIVE^PRINT CARRI

DEK Gas spring 186206
FRONT COVER DAMPER, 210N ( TXT ) DEK 140583
CAMERA MOUNT DEK 140127
CAMERA PLUG BRACKET DEK 119641
SMPSU, 650W WIDE RANGE I/P (FASTON TERMS) (TXT) DEK 160555
PSU^COSEL^450W MULTI O/P^(UL SEE TEXT 3) DEK 185312
BOM^^SOLVENT PUMP ASSY DEK 183390/183227/191088
BOM^^KIT^BAUMER SENSOR REPLACEMENT^ DEK 181563/114758
CAMERA, MOUNT DEK 145230
BOM^CABLE^CRIMPED ASSEMBLY^RAILS^ASM DEK 177055
BRG.STOP BRKT. 113163
FITTING, PNEUMATIC ELBOW MINIATURE, OD4MM x M5 THD DEK 107265
TOOLING PIN, MAGNETIC, 81mm, STD DIA. DEK 107785
FITTING^AIR^UNION^INLINE 6MM (TXT) DEK 190216
SOLENOID VALVE 5 PORT 2 POSITION DEK 165431


BOARD STOP DEK119673 CAMERA, MOUNT DEK145230 Green DEK 145011
PHOTO SENSOR (SUNX) DEK 112246
PHOTO SENSOR, SUNX DEK 109239
OPTO SENSOR DEK 107458
SENSOR^^FORK^4W - OMRON EE-SX675(TXT) DEK 191650
SENSOR^PHOTOELECTRIC DIFFUSE FHDK 14N5101/S35A
 DEK 183388 USC SOLVENT SOLENOID VALVE LOOM BOM ( TXT ) DEK 146111
DRAG CHAIN, CAMERA X VISION DEK 156028
DRAG CHAIN, CAMERA Y VISION Y DEK 160432
CYLINDER^PNEUMATIC^COMPACT^12X10 DEK 158921
RARE EARTH POT TYPE MAGNET DEK 107443
BOM^LOOM^CAMERA X ^MOTOR PWR DEK 191238

DEK CBA40 GRAPHITE CAMERA 191640 8008629
DEK CBA40 CAMERA
DEK CBA40 GOLD CAMERA 191012 8008632
DEK CBA40 GRAPHITE CAMERA 191010 8008629
DEK CBA40 GRAPHITE CAMERA 198040 8012979
DEK CBA40 GRAPHITE CAMERA 8008629
DEK CBA40 GREEN CAMERA 191011 8008630
DEK CBA40 GREEN CAMERA 191641 8008630
DEK CBA40 GREEN CAMERA 198041 8012980
DEK CBA40 GREEN CAMERA 198811 8008630
DEK CBA40 HAWKEYE 1200 CAMERA 191644 8008634
DEK CBA40 HAWKEYE 1700 CAMERA 198044 8012983
DEK CBA40 HAWKEYE 400 CAMERA 191643 8008633
DEK CBA40 HAWKEYE 750 CAMERA 198043 8012982
DEK CBA40 HAWKEYE CAMERA 191013 8008633
DEK EUROSYSTEM 114546 GREEN LIGHT
DEK EUROSYSTEM 114546 RED LIGHT
DEK EUROSYSTEM 114547 GREEN LIGHT
DEK EUROSYSTEM 114547 RED LIGHT
DEK GSX CHASSIS
DEK HOZ ADV CPU CARD
DEK HOZ ARCON CPU CARD
DEK HOZ BLUECHIP CPU CARD
DEK INFINITY VISION CARD 160903
DEK MOTOR 107707
DEK MOTOR 119943
DEK MOTOR 133126
DEK MOTOR 133129
DEK MOTOR 140373 S644-3A+RM21-1000+PULLEY
DEK MOTOR 140737 COPY
DEK MOTOR 140737 S644+ENC+PULLEY+CONNS


DEK 193409 CONTROLLER BOARD
DEK 188988 MOTOR
DEK 185101 MOVING RAIL STEPPER
DEK 126000 Power Supply unit VS3-D5-H233-00
DEK 112511 VANE
DEK 107422 CYINDER CONNECTOR
DEK 265LT PCIB40 PN: 107689
DEK BOM SQUEEGEE 193292 & 157382

DEK Part  125459 NEXT MOVE CARD
DEK Part  145520 dek camera y motor
DEK Part  145520 CAMERA Y MOTOR
DEK Part  133128 CMAERA Y MOTOR
DEK Part  133127 CAMERA X SERVO MOTOR
DEK Part  160706 dek camera y motor
DEK Part 160708 RISING TABLE SERVO MOTOR
DEK Part 185003 MOTOR^CAMERA Y^(BG65X50-CI)^WITH 7.66:1 GEARBOX
DEK Part 185002 MOTOR^CAMERA X^(BG65X50-CI)^WITH 7.66:1 GEARBOX
DEK Part 185009 BOM^LOOM^BELT MOTOR (DUNKERMOTOREN) EA
DEK Part 145817 CAMERA 'X' MOTOR AT/20' /
DEK Part 133126 CARRIAGE MOTOR
160702 CARRIAGE MOTOR
160704 CAMERA X SERVO MOTOR
191492 BOM^ASSY.^MOTOR^RISING TABLE


188988 rising table motor
188962 BOM^MOTOR^DRIVE^PRINT CARRIAGE
140737 rising table servo motor
140737 RISING TABLE SERVO MOTOR
140375/76/77 ACTUATOR MOTOR
186358/59/60 ACTUATOR MOTOR
185463 DESC:ACTUATOR^STEPPER^CHASE^ALIGNMENT
160457 cluch
183388 in or out pcb sensor
188317 BOM^LOOM^CAMERA CARRIAGE SIGNALS
193409 NEXTMOVE ES USB 6 STEP CONTROLLER(TXT)
165675 CYLINDER 4 STROKE 20 BORE ( TXT )
157729 rear rail motor loom assemble
181229 BOM^LOOM & MOTOR^CONVEYOR
160422 SPEED UP REAR RAIL MOTOR AND LOOM ASSEMBLY BOM
160418 SPEED UP FRONT RAIL MOTOR AND LOOM ASSEMBLY BOM
181452 BOM^PAPER CLEAN MOTOR



DEK Part 193377 boRAD STOPper
DEK Part 193408 1394 cable
DEK Part 5157438 CLAMP BORAD
DEK Part X3 X4EUROSTEP CONTROLLER RS485 16MHZ
DEK Part 145015 X1 X2EUROSYSTEM CONTROLLER RS485 16MHZ EA
DEK Part  160903 VISION CARD(8100L)
155827 COGNEX 8100M CARD (SPARES - NO LICENCE)
160555 SMPSU,650W WIDE RANGE I/P
191088 183390 BOM^SOLVENT PUMP^USC
160903 8100l cognex vision card
114025 CARD FO SERVO MOTOR
DEK Part 137516 CLAMP Board
DEK Part 137519 board clamper assy
190130 KEYBOARD^^USB^TRACKBALL INTEGRATED
DEK Part 181009 CPU BOARD
DEK Part 137325 486 CPU BOARD
DEK Part 145009 VISION CARD
DEK Part 185512 DUAL STEPPER CARD
185020 NEXT MOVE ES INTERFACE CARD
142253 CAN CONTROL CARD (MULTIMOVE) IO ( TXT )
DEK Part 191650 CAMERA SENSOR
DEK Part 156039
160723 CENTRE SECTION BOARD AT RIGHT B'GND SUP. OPTO
160721 CENTRE SECTION BOARD AT LEFT B'GND SUP. OPTO
191103 RISING TABLE MOTOR CONTROLLER
DEK 193409 CONTROL BOARD CONTROLLER 

If there is no matching models，pls contact us directly！