Joy Technology Co.,Limited
SMT Equipment∣SMT parts∣SMT Solution provider
Solderingfumeinelectronicsmanufacturing-damagingeffectsandsolutionsforremoval Modernelectronicsmanufacturingismadeupbyamultiplicityofdifferentsepara...
To successfully achieve lead-free electronics assembly, each participant in the manufacturing process, from purchasing to engineering to maintenance to Quality/Inspection, must have a solid understanding of the changes required of them. This pertains to considerations regarding design, components, PWBs, solder alloys, fluxe s, printing, reflow, wave soldering, rework, cleaning, equipment wear & tear and inspection.
Defects and prevention, the current impact of the main problem of welding process is lead to lead-free welding conversion and miniaturization trend. Micro-welding refers to a printed circuit board with more SMD components.
In conventional electronic assembly processes, wave soldering techniques are commonly used for welding of PCB-mounted board assemblies (PTH). But the wave soldering has many shortcomings: can not be distributed in the welding surface of high-density, fine pitch patch components，
The basic constituent elements of the surface mount assembly used to form the land pattern of the circuit board, that is, the combination of pads for the particular component type design. There is no worse than the design of the pad structure It is difficult and sometimes impossible to achieve the desired weld point when a pad structure is not designed correctly.
SPI (SolderPaste Inspection) refers to the solder paste detection system, the main function is to detect the quality of solder paste printing, including volume, area, height, XY offset, shape, bridge, etc.
AT one time the 0201 placement has been placed difficlity in the SMT industry, many OEM circuit board assemblers need to incorporate even smaller components and technologies into their products due to size, weight, and power consumption The contract manufacturer (CM-contract manufacturer) must also have new technology to keep the assembly process up to date and provide a complete range of services for the customer, and for the machine manufacturer, the challenge is to develop a more time in a dynamic technological change Resistant to outdated assembly equipment.
Reflow before the appropriate preheating PCB board; re-flow after the rapid cooling of the solder joints. Two of the most critical processes for the successful repair of SMT are also the two most likely to overlook the problem:
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