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Technique & Support

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  • A New Stenciling Method for Reworking SMT Components

    2016-08-04

    When reworking more complex SMT components such as finer pitch SMT components, SMTconnectors and even area array devices, the most common method of printing on the printing selectively on the PCB has some serious shortcomings. The most significant problems incurred with this method includes the lack of co planarity between the stencil and PCB, holding the stencil in position during the printing process, the large space taken up by the metal stencil/fixturing system and the cleaning required. These problems all lead to a decrease in yield.

  • Modern Selective Soldering Process Technology

    2016-07-12

    The competition in the EMS sector has considerably intensified over the last few years,. The enormous pressure to reduce production costs, which every service provider today has to face, frequently forces the organization to have a critical look at their established manufacturing structure and manufacturing methods. Turck-Duotec has successfully confronted these challenges on an ongoing basis, and, through continuous optimization of the production flow and methods

  • Miniaturization with Help of Reduced Component to Component Spacing

    2016-06-08

    Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are many ways to increase the packaging density and a few examples would be to stack them with Package on Package (PoP), fine pitch CSP’s, 01005 and last but not least reduced component to component spacing for active and passive components.

  • Printing and Assembly Challenges for Quad Flat No-Lead (QFN) Packages

    2016-05-12

    QFN (quad flatpack, no leads) and DFN (dual flatpack, no lead) are becoming more popular in new component releases. Their very small form factor allows smaller packages, better grounding, and better heat sink thermal properties compared to other SMT packages.

  • Panasonic CM602 Machine CPK Calibration

    2016-05-04

     Install the corresponding nozzle and material according to the nozzle and material configuration in the CPK program ,Warm-up operation: the machine is warmed up to reach normal production status

  • Panasonic SMT Nozzles maintenance operation method

    2016-04-27

    Panasonic CM602, Panasonic CM212 SMT Nozzles are maintained in series order: (1) Insert needle cleaning nozzle rod; (2) wiping the reflector; (3) Check the nozzle rod for deformation

  • Using Flexible Circuits as an Electronic Interconn

    2016-03-17

     Flexible Circuits are proven, reliable interconnect solutions for many of today’s electronic packages. This article gives some general guidelines in terms of “dos” and “don’ts” that will help the engineer or designer make better decisions when using flexible circuitry as an electronic interconnect.

  • YAMAHA placement machine - YS24 Product Advantages Features Production Efficiency

    2016-02-23

    First, YAMAHA placement machine - YS24 product advantages:
    1) 72,000 CPH (0.05 sec/CHIP) excellent placement capability Newly developed two-stage conveyor table,
    2) 34KCPH/m2 world top area productivity, world's first area productivity 34,000 CPH / m2
    3) Realize ultra-large substrate L700×W460mm

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