Frequently quality problems of SMT maching process.
1, leading to leakage of patch main factors
1.1, SMT placement process, medium component feeding rack (feeder) feeding is not in place
1.2, SMT placement process, components suction nozzle gas road plug, suction nozzle damage,
suction nozzle height is not correct
1.3, the equipment vacuum, gas road failure, congestion
1.4, the circuit board purchase bad, produce deformation
1.5, there is no solder paste or solder paste on the circuit board
1.6, components quality problems, the thickness of the same species inconsistent
1.7, the patch machine calling program has errors or leaks, or programming, the choice of the
thickness parameters of components is wrong
1.8, because the operation is not standard, such as factors accidentally touch.
2, leading to the SMC resistor chip, flip side, side pieces of the main factors
2.1, components feeding rack (feeder) feeding abnormal
2.2 、 the height of the nozzle is not right
2.3 、 the height of the head is not right
2.4. The size of the loading hole of the component braid is too large, and the component is
turned over by vibration
2.5 the direction of the loose material into the braid is reversed
3, leading to the main component bias
3.1, patch machine programming, components of the X-Y axis coordinates is not correct
3.2, chip suction nozzle reason, so that the suction instability
4, leading to the main components of the patch damage
4.1, the positioning pin is too high, so that the position of the circuit board is too high,
the components are pressed when mounted
4.2, patch machine programming, components of the Z axis coordinates is not correct
4.3. The suction head spring of the mounting head is jammed
Panasonic CM202 CM402 CM602 NPM Nozzle 110 115 KXFX0383A00
Samsung SM320 IC tray
YAMAHA FEEDER CALIBRATION JIG