Product description
JUKI KE2080 Ppacement machine Feature
The ultra-flexible KE-2080 can place a wide range of components from 0402 (01005) and ICs, to odd-form：
all at industry leading accuracy and speed.
Chip：
20,200CPH（laser centering/Optimum）（0.178Sec./chip)
16,700CPH（laser centering/IPC9850）
IC：
1,850CPH (vision centering / effective tact)
4,860CPH with MNVC option.
(510 x 360 mm) L-Wide substrate (510 x 360 mm) (optional) E Substrate (510 x 460 mm) *1
Component size: Laser recognition 0402 (English 01005) Chip ~ 33.5mm square element
Image recognition standard Camera: 3mm square element * 2 ~ 74mm square or 50 × 150mm
high resolution camera (optional): 1.0 × 0.5mm * 3 ~ 48mm square element or 24 × 72mm
Component Mounting speed: Chip components Best conditions: 0.178 seconds / chip
(20,200CPH) IPC9850 16,700CPH IC components * 3 1,850CPH 4,860CPH * 4
Component Mounting accuracy: Laser recognition: ± 0.05mm (Cpk ≧ 1)
Image recognition: ± 0.03mm (± 0.04mm when using MNVC (optional)
Component Mounting Type: Up to 80 (converted to 8mm) * 5
One multi-nozzle laser head (6 nozzles) plus one high resolution head (1 nozzle)
From 0402 (01005) to 74mm square components or 50×150mm
Vision centering system (featuring bottom, side, and back lighting, all ball recognition and split recognition)
1）Please ask for details on E size board.
2）When using MNVC. (option)
3）When using high-resolution camera. (option)
4）Effective tact: The IC placement speed indicates an estimated value obtained when the machine
places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board.
(CPH=number of components placed for one hour)
5）Estimated value when using MNVC (option) and picking up components simultaneous with all nozzles.
6）Including matrix tray changer, max 110.
Panasonic CM202 CM402 CM602 NPM Nozzle 110 115 KXFX0383A00
Samsung SM320 IC tray
YAMAHA FEEDER CALIBRATION JIG