Joy Technology Co.,Limited
SMT Equipment∣SMT parts∣SMT Solution provider
Its alloy comprises the 63% tin content and the 37% lead content. Its working temperature falls into
the preheat temperature from 90℃ to 150℃, the melting point of 183℃, and the reflow temperature
range from 190℃ to 100℃. This product is suitable for the highly demanding reflow-soldering process.
Model Number: Sn63Pb37Sn63Pb37
Composition: Sn Pb
1. With superb fluidity and nice soldering effect, our product can accomplish the exquisite printing
of the pad, the separation distance of which can be only 0.3mm.
2.There are very few changes of viscosity during the continuous printing process.
The viscosity will not be altered, even after 8 hours of operation of the steel mesh.
Moreover, our product can still maintain the favorable and continuous printing effect.
3.The original shape will not be changed after several hours of printing process.
In addition, the surface mount assembly will not be affected.
4.Beyond that, our Sn63Pb37 mid temperature tin lead solder paste for PCB can give
favorable wetting property on the substrate made from different materials.
5. Owing to its wonderful soldering performance, this product will not produce any tiny
solder bead after the soldering process is completed.
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