Joy Technology Co.,Limited

Analysis on the Function of SMT Nozzle

SMT nozzle In order to meet the usage reqiurement, when people in the design of the nozzle, the SMT nozzle touching elements are usually designed to the center of the symmetrical shape, and as the background of the nozzle face design designed to matte And the surface is not mixed color, of course, this background is usually designed as a single color, such as yellow and black.
Rust - proof lubricants
SMT nozzle is not only the placement of the components of the device to paste, put the key parts of the action, but also the optical vision system camera background, it is mainly the use of vacuum adsorption to the components to absorb, and Use the blower to put the element attached to the nozzle into the coordinate position of the circuit board.

When the nozzle to absorb the components, to achieve the ideal situation must ensure that the center of the component, the center of the nozzle and the image of the center of the space should be coincident, and optical vision system adjustment is actually Compensation for the actual work of the case does not coincide with the deviation caused.

Different mounting elements need to be sucked with different suction nozzles. Almost every nozzle will have a reflective background, which is primarily intended to have a good background for image pickup to ensure accurate information on the target when the image is processed Protruding, nozzle When extracting an image, the nozzle as a background, so that the component image contrast enhancement, more clearly visible.


(1) nozzle wear, nozzle deformation, clogging, damage caused by insufficient pressure, resulting in suction components, so to regularly check the degree of wear of the nozzle, the serious to be replaced.

(2) the impact of the feeder, the feeder feed bad (feeder gear damage), material hole is not stuck in the feeder gear, the feeder below the foreign body, card spring wear), pressure Cover plate, spring and other operating mechanism to produce deformation, rust, etc., resulting in components sucking, standing or sucking device, it should be regularly checked, to deal with, so as to avoid a large number of device waste.


(3) vacuum negative pressure is insufficient, when the nozzle to take the component, the nozzle at a certain negative pressure, the components adsorbed on the nozzle, the nozzle to pick up the components are unusual use of negative pressure detection mode, when the negative pressure When the sensor detection value is within a certain range, the machine thinks that the suction is normal, otherwise it thinks that the drawing is bad, and when the element is sucked, the vacuum negative pressure should be above 53.33kPa so as to have enough vacuum to suck the component.If the vacuum negative pressure is insufficient, Will not be able to provide enough suction to absorb the components, in use, we must always check the vacuum negative pressure, and regularly clean the nozzle, but also pay attention to each placement of the vacuum filter on the head of the pollution, its role is to reach the suction The mouth of the gas source to filter, to be black to be replaced, to ensure the smooth flow of air.

(4) to absorb the height of the impact of the suction nozzle is the ideal height of the suction nozzle is exposed to the surface of the component and then down the pressure 0.05mm, if the pressure is too large, it will cause the component is pressed into the tank instead If the absorption of an element is not good, it may be appropriate to adjust the height of the suction up slightly, for example, 0.05mm. The author in the actual work process has encountered a material on all the components are not well Of the situation, the solution is to system parameters in the material extraction of the height of the appropriate move up a little.

(5) nozzle to the incoming problem, some manufacturers of chip components packaging quality problems, such as large spacing between the teeth, tape and plastic film between the sticky is too large, too small trough size are Causing the possible cause of the component can not be taken.