Joy Technology Co.,Limited

In the solder, it is an indispensable auxiliary material, its role is extremely important.

1) Dissolving the oxide film on the surface of the substrate to be welded In the atmosphere, the surface of the substrate to be bonded is always covered with an oxide film having a thickness of about 2 × 10-9 to 2 × 10-8 m. In the welding, the oxide film will inevitably prevent the solder on the base metal wetting, welding can not be normal, it must be coated on the surface of the base metal flux, so that the surface of the parent metal oxide reduction, so as to achieve the purpose of eliminating the oxide film.

2) to prevent the re-oxidation of the base metal material in the welding process needs to be heated, high temperature metal surface will accelerate oxidation, so the liquid flux covering the base metal and solder surface to prevent oxidation.

3) Reduce the surface tension of the molten solder The surface of the molten solder has a certain tension, as the rain falls on the lotus leaf, because the liquid surface tension will immediately coalescence into a ball of water droplets. The surface tension of the molten solder will prevent it from flowing to the surface of the base metal, affecting the normal operation of the wetting. When the flux is covered on the surface of the molten solder, the surface tension of the liquid solder can be reduced and the wettability is significantly improved.

4) to protect the role of welding the surface of the base metal was welding material in the welding process has destroyed the original surface protective layer. Good flux after welding, and quickly return to the role of protection welding consumables.

The role of solder paste paste:
In the electronic process SMT process, the main role of solder paste is bonding SMD material in the PCB should be the location of the pad to ensure that SMD SMD material will not be scattered patch. At the same time, after hot air reflow soldering and then play a fixed SMD material and connected circuit of the important role. Choose high-quality solder paste, the use of solder paste mixer to stir evenly, the use of automatic, semi-automatic or manual solder paste printing equipment to paste the quality of the printing process in the PCB on the pad. AOI (automatic optical inspection machine) check the printing paste should be completely covered PCB pad, printing thickness should be equal to the thickness of steel mesh, clear resolution, good mold release. Otherwise, the cleaning, cleaning, re-printing, solder paste printing quality directly affect the quality of solder material welding quality, the quality of welding directly affect the reliability of the product, so throughout the production process, is generally set to key Process. Therefore, in the machinery and equipment, the use of tools, materials, selection, personnel skills, methods of operation, environmental conditions must meet the process requirements, in order to achieve high efficiency, good quality purposes.

Paste is divided into: a solder paste and lead-free solder paste, lead-free solder paste that is environmentally friendly solder paste
SMT chip production The role of steel mesh: steel mesh used to semi-liquid semi-solid state of the tin paste to the pcb board, the current popular circuit board in addition to the power board outside the use of surface mount SMT technology, the pcb board There are a lot of surface-mount pad, that is, no kind of over-hole, and steel mesh hole is just the corresponding PCB board pad, hand brush tin with a horizontal hard brush to semi-liquid semi-solid state of tin slurry through steel Online hole brush to the PCB board, and then through the placement machine up to paste components, and then after the reflow soldering.

Steel mesh is divided into three kinds: laser steel mesh, etching steel mesh, polished steel mesh
SMT soldering iron role: electric iron is the electronic production and electrical maintenance essential to the main tool, the main purpose is the welding element and wire, according to the structure can be divided into internal heat soldering iron and external electric soldering iron, according to the function can be divided For the soldering iron and tin soldering iron soldering iron, according to the use of different is divided into high-power electric soldering iron and low-power electric soldering iron. The internal heat-type electric soldering iron is small and inexpensive. General electronic production with 20W-30W of the internal heating electric iron. Of course, there is a 50W external thermal soldering iron can be prepared. The electric heating of the electric iron is higher, and the replacement of the tip is also more convenient.