Joy Technology Co.,Limited

2) IPC-SA-61 A: Semi-water wash manual after welding. Including all aspects of semi-aqueous cleaning, including chemical, produced residues, equipment, processes, process control, and environmental and safety considerations.
3) IPC-AC-62A: Water-saving cleaning manual after welding. Describe the types and properties of manufacturing residues, water cleansers, water cleaning processes, equipment and processes, quality control, environmental control and employee safety, and the determination and determination of cleanliness.

4) IPC-DRM -4 0E: Through Hole Welding Point Evaluation Desk Reference Manual. In accordance with the standard requirements of the components, holes and welding surface coverage and other detailed description, in addition to including computer-generated 3D graphics. Covering the filling, contact angle, dip tin, vertical filling, pad cover and a large number of welding points
Defect situation.

5) IPC-TA-722: Welding technology evaluation manual, covering general welding, welding materials, manual welding, batch welding, wave soldering, reflow soldering, gas welding and infrared welding.

6) IPC-7525: Template Design Guide. Guidance for the design and manufacture of solder paste and surface mount adhesive coating templates i also discussed template design using surface mount technology and describes the use of solder bumps with flip-chip or flip chip components Technology, including overprint, double print and stage template design.

7) IPC / EIA J-STD-004: Specification requirements for flux 1 Includes Appendix I. Contains rosin, resin and other technical indicators and classification, organic and inorganic fluxes classified according to the content and degree of activation of the halide in the flux. It also includes the use of flux, the flux-containing material, and the low levels used in the no-clean process Residual flux.

8) IPC / EIA J-STD -005: Solder Paste Specifications Requirements One includes Appendix I. Lists the solder paste characteristics and technical requirements, as well as test methods and metal content standards, as well as viscosity, collapse, solder balls, stickiness and solder paste dip tin performance.

9) IPC / EIA J-STD -0 06A: Electronic grade solder alloy, flux and non-flux solid solder specifications. For the electronic grade solder alloy, for the rod, ribbon, powder flux and non-flux solder, for the application of electronic solder for special electronic grade solder to provide the term naming, specification requirements and test methods.
10) IPC-Ca-821: General requirements for thermally conductive adhesives. Including the requirements and test methods for the thermal conductivity of the components to be bonded to the appropriate location.

11) IPC-3406: Guide for Conducting Surface Coated Adhesives. Guidance is provided for the selection of conductive adhesives as solder alternatives in electronics manufacturing.

12) IPC-AJ-820: Assembly and Welding Manual. Including the description of the assembly and welding inspection techniques, including terms and definitions; printed circuit boards, types of components and pins, materials for solder joints, component installation, design reference and outline; welding technology and packaging; Cleaning and filming; quality assurance and testing.

13) IPC-7530: Guidance on the temperature profile of the batch welding process (reflow soldering and wave soldering). In the temperature curve acquisition in a variety of test methods, techniques and methods to provide guidance for the establishment of the best graphics.